Thermal Activation of Asymetrical Composites for Vibration Control
نویسندگان
چکیده
منابع مشابه
Thermal Vibration of Composites and Sandwich Laminates Using Refined Higher Order Zigzag Theory
Vibration of laminated composite and sandwich plate under thermal loading is studied in this paper. A refined higher order theory has been used for the purpose. In order to avoid stress oscillations observed in the implementation of a displacement based finite element, the stress field derived from temperature (initial strains) have been made consistent with total strain field. So far no study ...
متن کاملdevelopment and implementation of an optimized control strategy for induction machine in an electric vehicle
in the area of automotive engineering there is a tendency to more electrification of power train. in this work control of an induction machine for the application of electric vehicle is investigated. through the changing operating point of the machine, adapting the rotor magnetization current seems to be useful to increase the machines efficiency. in the literature there are many approaches wh...
15 صفحه اولVibration Analysis of Glass Fiber Reinforced Composites
Glass fiber reinforced resol/vac-eha composites have been fabricated in laboratory to determine the dynamic behavior of glass fiber reinforced composites. Resol solution was blended with vinyl acetate-2-ethylhexyl acrylate (vac-eha) resin in an aqueous medium with varying volume fraction of glass fibers. The role of fiber/matrix interactions in glass fibers reinforced composites were investigat...
متن کاملA Numerical and Analytical Solution for the Free Vibration of Laminated Composites Using Different Plate Theories
An analytical and numerical solution for the free vibration of laminated polymeric composite plates with different layups is studied in this paper. The governing equations of the laminated composite plates are derived from the classical laminated plate theory (CLPT) and the first-order shear deformation plate theory (FSDT). General layups are evaluated by the assumption of cross-ply and angle-p...
متن کاملThermal Conductivity of Diamond Composites
A major problem challenging specialists in present-day materials sciences is the development of compact, cheap to fabricate heat sinks for electronic devices, primarily for computer processors, semiconductor lasers, high-power microchips, and electronics components. The materials currently used for heat sinks of such devices are aluminum and copper, with thermal conductivities of about 250 W/(m...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Modern Mechanical Engineering
سال: 2013
ISSN: 2164-0165,2164-0181
DOI: 10.4236/mme.2013.33a001